Monday, December 08, 2025
LATEST INDUSTRY NEWS:

R&D BREAKTHOUGHS AND PARTNERSHIPS

Qualcomm and Arduino hardware featuring the new Arduino UNO Q board powered by the Qualcomm Dragonwing processor, representing edge AI innovation.

Qualcomm to Acquire Arduino, Advancing Edge AI Development

Image of a semiconductor chip labeled “Artificial Intelligence,” representing Emerson NI’s AI-enabled test and measurement technology, featured in Electronics Industry Monthly

Emerson Streamlines T&M Workflows with New AI-Enabled Advisor

Emerson has announced the launch of its Nigel™ AI Advisor, now integrated into the company’s flagship NI LabVIEW™ and NI TestStand™ software platforms. Designed to simplify workflows and increase productivity, Nigel represents Emerson’s first step in embedding test-optimized artificial intelligence

Surecore product photo depicting AI focused memory designs services appearing on Electronics Industry Monthly

sureCore Expands AI-Focused Memory Design Services

sureCore, global industry experts in ultra-low power embedded memory solutions, has expanded its sureFIT™ custom memory design service to address the evolving requirements of AI chip developers. This initiative is aimed at further supporting performance

SENSORS, TESTING, AND SIMULATION

Silicon carbide-based traction inverter solution featuring onsemi EliteSiC and Schaeffler integration for a PHEV platform, featured in Electronics Industry Monthly

onsemi, Schaeffler Partner on New EliteSiC PHEV Platform

onsemi, global industry experts in silicon carbide power semiconductors, have announced the expansion of their ongoing collaboration with motion technology company Schaeffler to supply next-generation silicon carbide MOSFETs for a new plug-in hybrid electric vehicle (PHEV) platform.

TDK Releases ASIL C-Ready 2D Hall-Effect Sensor Series

TDK Corporation has introduced the Micronas HAL/HAR 35xy series of stray-field robust 2D Hall-effect position sensors. Designed for automotive and industrial use, the new sensor family is derived from the existing HAL/HAR 39xy platform but tailored

Bosch and Element Six Form Quantum Sensor Joint Venture

Bosch has announced the creation of Bosch Quantum Sensing, a joint venture established in collaboration with Element Six, a leading provider of synthetic diamond solutions.

Voyant Photonics CARBON LiDAR sensor image, appearing on Electronics Industry Monthly

Voyant Photonics Intros CARBON LiDAR with FMCW Sensor on Chip

Voyant Photonics, developers of LiDAR-on-a-chip solutions for 3D sensing, have announced the availability of CARBON, a Frequency Modulated Continuous Wave (FMCW) LiDAR sensor featuring a highly integrated silicon photonic chip.

CEA-Leti optoelectronic device capable of sensing and modulating light, featured on Electronics Industry Monthly

CEA-Leti Unveils First Device to Both Sense and Modulate Light

CEA-Leti researchers have developed the first device capable of both sensing and modulating light within a single unit. This innovation integrates a liquid crystal cell with a CMOS image sensor, enabling a compact and scalable system with intrinsic optical alignment. The breakthrough is expected to drive the adoption of digital optical phase conjugation (DOPC) techniques […]

THIS MONTH’S FEATURED VIDEO COURTESY OF GOCAR ELECTRONIC