Electronics Industry Monthly image of Qualcomm Snapdragon automotive compute platform supporting Stellantis software-defined vehicle and ADAS technologies

Stellantis, Qualcomm Expand Automotive Compute Collaboration

May 2026 Molly Bakewell Chamberlin118

Stellantis and Qualcomm Technologies have announced the expansion of their multi-year collaboration for next-generation automotive compute platforms. The companies noted their intent to focus on the development of advanced driver assistance systems, digital cockpit technologies, vehicle connectivity, and software-defined vehicle architectures across Stellantis’ global vehicle portfolio. The core focus of the collaboration is on integration […]

Electronics Industry Monthly image of the Vishay Intertechnology VETH100A1DD1 automotive Ethernet ESD protection diode.

Vishay Intertechnology ESD Diode Passes IEEE 10BASE-T1S Tests

May 2026 Molly Bakewell Chamberlin113

Vishay Intertechnology has announced that its VETH100A1DD1 ESD protection diode has passed IEEE 10BASE-T1S compliance testing, supporting its use in automotive One-Pair Ethernet (OPEN) bus architectures designed for next-generation in-vehicle networking applications.

TDK Releases ASIL C-Ready 2D Hall-Effect Sensor Series

April 2025April 10, 2025 Molly Bakewell Chamberlin532

TDK Corporation has introduced the Micronas HAL/HAR 35xy series of stray-field robust 2D Hall-effect position sensors. Designed for automotive and industrial use, the new sensor family is derived from the existing HAL/HAR 39xy platform but tailored

Power Integrations InnoSwitch IC shown in EV power system application, featured on Electronics Industry Monthly

Power Integrations Debuts 1700V IC for 800V EV Applications

December 2024February 20, 2025 Molly Bakewell Chamberlin486

Power Integrations, a provider of high-voltage integrated circuits (ICs) for energy-efficient power conversion, has introduced a wide-creepage package option for its InnoSwitch™3-AQ flyback automotive switcher IC, designed to meet the stringent requirements of next-generation EVs.

Purely decorative image appearing in an article post on Electronics Industry Monthly entitled Infineon, Siemens Partner on ECU Software for Enhanced SDV's

Infineon, Siemens Partner on ECU Software for Enhanced SDV’s

November 2024July 15, 2025 Molly Bakewell Chamberlin527

Infineon Technologies and Siemens Digital Industries Software have announced a partnership to advance software-defined vehicles (SDVs). The collaboration integrates Siemens’ Capital™ Embedded AR Classic software platform

ROHM silicon carbide (SiC) Schottky barrier diode for high-voltage xEV systems, featured on Electronics Industry Monthly

New ROHM SiC Schottky Barrier Diodes for High-Voltage xEV Systems

November 2024July 15, 2025 Molly Bakewell Chamberlin400

ROHM has announced the development of a new lineup of surface-mount silicon carbide (SiC) Schottky barrier diodes (SBDs) designed to meet the evolving demands of high-voltage systems in xEVs and industrial applications. The SCS2xxxNHR series offers significant improvements in insulation resistance through an innovative package design that increases creepage distance, supporting enhanced safety and performance. […]

Photo of Melexis MLX90424 integrated automotive brake pedal sensing module, purely decorative, showcasing its dual Triaxis® position-sensing technology and power-saving magnetic activation switch for enhanced vehicle safety.

Melexis Introduces Integrated Automotive Brake Pedal Sensor

October 2024July 15, 2025 Molly Bakewell Chamberlin416

The Tessenderlo, Belgium-headquartered Melexis has announced the global market launch of its MLX90424, a streamlined, integrated automotive brake pedal sensing module for enhanced vehicle safety and precision. This all-in-one solution combines dual Triaxis® position-sensing ICs together with a power-saving magnetic activation switch for reduced design complexity and optimized functional safety and performance.

Toshiba 900V automotive photorelay for 400V EV systems, featured on Electronics Industry Monthly

Toshiba Debuts 900V Automotive Photorelay for 400V EV Systems

October 2024July 15, 2025 Molly Bakewell Chamberlin396

Toshiba Electronic Devices & Storage Corporation (Toshiba) has introduced the TLX9150M, an automotive photorelay designed for use in 400V electric vehicle (EV) battery systems.

Infineon Debuts MOSFET with Integral Temp Sensor

June 2024January 1, 2025 Molly Bakewell Chamberlin517

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the 600V CoolMOS™ 8, a high-voltage superjunction (SJ) MOSFET family, expanding its widegap product portfolio into cost-effective Si-based solutions. Tailored for automotive electronics, the CoolMOS S7TA enhances reliability with its embedded temperature sensor, crucial for accurate junction temperature sensing. It’s designed for solid-state relay (SSR) applications, […]

X-FAB Enhances 180nm Auto-Grade HV CMOS Foundry Solution

May 2024January 3, 2025 Molly Bakewell Chamberlin638

The Tessenderlo, Belgium-based X-FAB Silicon Foundries SE, an analog/mixed-signal and specialty foundry, has announced significant updates to its XP018 high-voltage CMOS semiconductor fabrication platform. Among the recent enhancements are the additions of new 40V and 60V high-voltage primitive devices, offering an extended Safe Operating Area (SOA) for improved operational robustness. These next-generation devices exhibit up […]