Electronics Industry Monthly image of Qualcomm Snapdragon automotive compute platform supporting Stellantis software-defined vehicle and ADAS technologies

Stellantis, Qualcomm Expand Automotive Compute Collaboration

May 2026 Molly Bakewell Chamberlin118

Stellantis and Qualcomm Technologies have announced the expansion of their multi-year collaboration for next-generation automotive compute platforms. The companies noted their intent to focus on the development of advanced driver assistance systems, digital cockpit technologies, vehicle connectivity, and software-defined vehicle architectures across Stellantis’ global vehicle portfolio. The core focus of the collaboration is on integration […]

Automotive radar application shown in NXP Semiconductors image, featured in Electronics Industry Monthly

NXP Semiconductors Debuts Third-Gen Imaging Radar Processors

May 2025July 14, 2025 Molly Bakewell Chamberlin370

NXP Semiconductors, experts in automotive radar and secure edge processing, has introduced its S32R47 family of third-generation imaging radar processors. Built on 16 nm FinFET technology,

Purely decorative image appearing on Electronics Industry Monthly in an article entitled Synopsys, SiMa.ai Partner on Automotive Edge AI Solutions

Synopsys, SiMa.ai Partner on Automotive Edge AI Solutions

December 2024February 20, 2025 Molly Bakewell Chamberlin480

Synopsys, Inc. and SiMa.ai have announced a strategic collaboration aimed at accelerating the development of silicon and software for next-generation automotive edge AI applications. This partnership integrates Synopsys’ electronic design automation (EDA) tools, automotive-grade IP, and

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KIOXIA UFS Ver. 4.0 Flash Devices Achieve Automotive SPICE CL2

December 2024January 1, 2025 Molly Bakewell Chamberlin444

KIOXIA America, Inc. has announced that its Universal Flash Storage (UFS) Ver. 4.0 embedded flash memory devices for next-generation automotive applications have achieved Automotive SPICE® (ASPICE) Level 2 certification, making KIOXIA the first known industry manufacturer to receive this certification for automotive-grade UFS 4.0 devices.

Renesas and Nidec 8-in-1 E-Axle system for electric vehicles, featured on Electronics Industry Monthly

Renesas and Nidec Unveil Industry-First 8-in-1 E-Axle for EVs

November 2024January 3, 2025 Molly Bakewell Chamberlin429

Renesas Electronics Corporation, a global provider of advanced semiconductor solutions, has unveiled the industry’s first 8-in-1 proof of concept (PoC) for electric vehicle E-Axle systems. Developed in partnership with Nidec Corporation, the innovative design integrates eight essential functions into a single unit controlled by a single microcontroller (MCU), significantly reducing size, cost, and complexity for […]

Photo infographic showing the KYOCERA AVX e-Mobility solutions offering, purely decorative, and appearing in an article entitled KYOCERA AVX Showcases E-Mobility Solutions at Electronica 2024, currently appearing on Sensors and Testing Monthly

KYOCERA AVX Showcases E-Mobility Solutions at electronica 2024

November 2024January 3, 2025 Molly Bakewell Chamberlin368

KYOCERA AVX, industry experts in the design, development, and manufacture of advanced electronic components, is showcasing its e-mobility solutions at electronica 2024. The company’s exhibit at booth B4.502 will feature components designed to support high-reliability applications in e-mobility, automotive, transportation, and communications sectors.

Toshiba 900V automotive photorelay for 400V EV systems, featured on Electronics Industry Monthly

Toshiba Debuts 900V Automotive Photorelay for 400V EV Systems

October 2024July 15, 2025 Molly Bakewell Chamberlin396

Toshiba Electronic Devices & Storage Corporation (Toshiba) has introduced the TLX9150M, an automotive photorelay designed for use in 400V electric vehicle (EV) battery systems.

Photo of the ODOSOLUTIONS AB Launches the Megalog Datalogging Series, Transforming CAN-FD Applications for Industrial and Heavy-Duty Markets, purely decorative, and appearing in an article on Electronics Industry Monthly.

ODOSOLUTIONS AB Intros Megalog Datalogging Series

September 2024January 4, 2025 Molly Bakewell Chamberlin849

ODOSOLUTIONS AB (ODOS), experts in cloud-based data-logging solutions, has announced the launch of its Megalog datalogging series, specifically engineered to elevate CAN-FD (Controller Area Network Flexible Data) performance across industrial and heavy-duty applications. The Megalog, developed in collaboration with Kvaser, integrates Kvaser’s M.2 PCIe 4xCAN—a powerful four-channel CAN-FD interface card.

Pickering HIL test solution for EV battery system applications, featured on Electronics Industry Monthly

Pickering Interfaces Flexible HIL Test Solutions Aid EV Battery Systems

September 2024November 20, 2024 Molly Bakewell Chamberlin445

Pickering Interfaces, a provider of modular signal switching and simulation tools for electronic testing and verification, has announced new developments in flexible testing solutions for battery management systems (BMS) in electric vehicles (EVs).

Purely decorative image appearing in an article on Electronics Industry Monthly entitled AOS Expands Surface Mount & Module Packages for αSiC MOSFETs

AOS Expands Surface Mount & Module Packages for αSiC MOSFETs

August 2024December 8, 2024 Molly Bakewell Chamberlin641

Alpha and Omega Semiconductor Limited (AOS) has announced the expansion of its package options for second-generation 650V to 1200V αSiC MOSFETs. This portfolio expansion is aimed at critical applications such as xEV charging, solar inverters, and industrial power supplies. By offering more package options, AOS provides engineers with the flexibility to optimize their systems while […]