Synopsys, Inc. and SiMa.ai have announced a strategic collaboration aimed at accelerating the development of silicon and software for next-generation automotive edge AI applications. This partnership integrates Synopsys’ electronic design automation (EDA) tools, automotive-grade IP, and
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Bosch, a global leader in semiconductor and automotive technologies, has signed a preliminary memorandum of terms (PMT) with the U.S. Department of Commerce, securing up to $225 million in proposed direct funding under the CHIPS and Science Act. This funding will support Bosch’s
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STMicroelectronics (NYSE: STM), industry experts in semiconductor solutions, has announced the global market introduction of the ST67W611M1 wireless IoT module, developed in collaboration with Qualcomm Technologies. This module aims to accelerate the development of advanced consumer and industrial IoT solutions by combining ST’s powerful STM32 ecosystem with Qualcomm’s industry-leading wireless connectivity technologies.
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IBM has unveiled a breakthrough in co-packaged optics (CPO) technology, leveraging polymer optical waveguides (PWG) to significantly enhance AI data center performance. This advancement represents the first successful implementation of PWG to support CPO, as detailed in IBM Research’s recently published technical paper. The innovation enables high-bandwidth optical connectivity, offering faster AI model training, improved […]
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Molex, a global leader in electronics and connectivity solutions, has completed its acquisition of AirBorn, Inc., a manufacturer of rugged connectors and electronic components for mission-critical aerospace and defense applications. This acquisition strengthens Molex’s capabilities to deliver advanced, reliable interconnect solutions for industries requiring high-performance technologies in extreme operating environments. AirBorn, headquartered in Georgetown, Texas, […]
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