Category: Semiconductor

Renesas GreenPAK configurable mixed-signal IC for compact electronic designs, featured by Electronics Industry Monthly.

Renesas Adds Reprogrammability to Compact Mixed-Signal IC

Molly Bakewell Chamberlin

Renesas Electronics, global industry experts in embedded processing, analog, power and connectivity semiconductor technologies, has expanded its configurable mixed-signal portfolio with a compact GreenPAK™ IC designed to combine analog, timing and logic functions with in-system reprogrammability. The SLG46801 incorporates multi-time programmable non-volatile memory, allowing device configurations to be modified through an I²C-compatible interface after the […]

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Illustrative graphic of the EdgeCortix RAIDEN AI chiplet platform, featured by Electronics Industry Monthly.

EdgeCortix Scales AI Compute with Chiplet Platform

Molly Bakewell Chamberlin

EdgeCortix, global industry experts in energy-efficient AI semiconductor and edge computing technologies, has introduced a scalable chiplet platform designed to combine AI compute, memory, bandwidth and high-speed connectivity for robotics, autonomous systems, aerospace and defense, industrial equipment and other edge-based applications. Known commercially as RAIDEN™, the platform uses a modular architecture that scales from a […]

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Product graphic illustrating proteanTecs and GUC lifecycle health and performance monitoring for custom SoCs, Electronics Industry Monthly.

proteanTecs, GUC Expand SoC Lifecycle Monitoring

Molly Bakewell Chamberlin

proteanTecs and Global Unichip Corporation have expanded their collaboration to bring embedded health and performance monitoring deeper into GUC custom SoC designs, extending the relationship beyond high-bandwidth memory, die-to-die interfaces and advanced packaging into the compute fabric itself. Under the expanded agreement, GUC will offer proteanTecs’ monitoring technology to ASIC customers as part of its […]

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Semiconductor wafer representing Navitas Semiconductor development of 10 kV silicon carbide power devices, Electronics Industry Monthly.

Navitas Semiconductor to Develop 10 kV SiC Power Devices for U.S. Army

Molly Bakewell Chamberlin

Navitas Semiconductor has been selected by the U.S. Army to develop next-generation 10 kV silicon carbide power devices under the Accelerated, Large-Area, 10 kV SiC IGBT, or ALATTIS, program. Sponsored by the U.S. Army Research Laboratory under DEVCOM and supported by the Joint Experimentation and Technology Accelerator, the prototype program will develop and validate a […]

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EnSilica graphic announcing its Milan Space and Communications Semiconductor Centre of Excellence, Electronics Industry Monthly.

EnSilica to Open Milan ASIC Center for Space Communications

Molly Bakewell Chamberlin

EnSilica, a UK fabless semiconductor company specializing in mixed signal, RF, mmWave and digital ASICs, plans to open a Space and Communications Semiconductor Centre of Excellence in Milan, Italy, expanding its engineering capabilities in satellite and advanced communications silicon. The company initially plans to recruit 20 specialist modem and mmWave engineers over the next six […]

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lowRISC, SCI Release Sunburst Repo for Secure MCU Design

Molly Bakewell Chamberlin

lowRISC C.I.C., the open silicon ecosystem organisation, together with SCI Semiconductor, a leader in CHERI solutions, today announced the release of the open-source Sunburst Chip design repository. The release marks a key milestone in phase two of the DSbD/UKRI-funded Sunburst Project (Grant Number: 107540), and supports the commercialisation of CHERIoT-Ibex based secure microcontrollers, including SCI’s […]

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Pragmatic Semiconductor Launches Sustainable Flexible NFC Chip Line

Molly Bakewell Chamberlin

Pragmatic Semiconductor Ltd., experts in flexible semiconductor technology, have announced the launch of Pragmatic NFC Connect, a new line of RFID near-field communication (NFC) products designed to expand item-level intelligence across mass-market goods. Built on the company’s FlexIC (flexible integrated circuit) technology, the line delivers NFC endpoint capabilities in an ultra-thin, flexible, and low-carbon form […]

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