Infineon Technologies has announced that its radiation-hardened 512 Mbit QSPI NOR Flash memory has received QML-V and QML-P qualifications from the Defense Logistics Agency Land and Maritime (DLAM).
This certification represents the highest reliability standard for microcircuits awarded by the U.S. government, ensuring that the device meets the stringent performance and durability requirements for space and other extreme environment applications.
Industry Recognition and Future Development
With these qualifications, the Infineon 512 Mbit QSPI NOR Flash becomes the first known QML-qualified radiation-hardened NOR flash memory available to the space industry. It features a fast 133 MHz quad serial peripheral interface (QSPI) and delivers the highest known density, total ionizing dose (TID), and single-event effects (SEE) performance of any fully QML-qualified non-volatile memory for space-grade FPGAs and multi-core processors.
“The introduction of our first QML-P certified product is further testament to our commitment to deliver highly reliable and high-performance memories for next-generation space requirements,” said Helmut Puchner, Vice President, Fellow, Aerospace and Defense, Infineon Technologies. “Our in-house developed SONOS technology is an ideal solution for radiation and power-limited environments. Further higher density NOR Flash products, as well as AI/ML targeted compute-in-memory solutions, are already in progress to further utilize our SONOS technology in these highly critical satellite applications.”
High-Performance Radiation-Hardened Memory for Space Applications
The Infineon 512 Mbit QSPI NOR Flash is built on the company’s own SONOS (silicon-oxide-nitride-oxide-silicon) technology, which per the company, enables a 30% faster operating speed compared to lower-density alternatives while maintaining high radiation tolerance. It supports up to 10,000 program/erase (P/E) cycles with data retention of up to 10 years. The 133 MHz QSPI interface provides high-speed data transfer rates to meet the performance requirements of space-grade FPGAs and processors. The memory device is available in two package options:
- Ceramic QFP (QML-V): 1” x 1” board footprint
- Plastic TQFP (QML-P): 0.5” x 0.8” footprint
Designed for storing configuration images for space-qualified FPGAs and boot code for multi-core processors, the device offers the highest known density and radiation performance available for space-based applications.
Product Availability
Quantities of the Infineon DLAM QML-V/P-qualified 512 Mbit QSPI NOR Flash are now available for customer order.
About Infineon
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is a global semiconductor manufacturer specializing in power systems and IoT solutions. With approximately 58,060 employees as of September 2024, the company reported €15 billion in revenue for the 2024 fiscal year. Infineon is publicly traded on the Frankfurt Stock Exchange (IFX) and the OTCQX International market in the United States (IFNNY).
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