STMicroelectronics (NYSE: STM), industry experts in semiconductor solutions, has announced the global market introduction of the ST67W611M1 wireless IoT module, developed in collaboration with Qualcomm Technologies. This module aims to accelerate the development of advanced consumer and industrial IoT solutions by combining ST’s powerful STM32 ecosystem with Qualcomm’s industry-leading wireless connectivity technologies.
Leveraging the STM32 ecosystem, which includes over 4,000 commercial part numbers and STM32Cube software and tools, the module enhances the development of edge AI applications. The ST67W611M1 features the Qualcomm® QCC743 multiprotocol connectivity system-on-a-chip (SoC), pre-loaded with Wi-Fi 6, Bluetooth 5.3, and Thread. Designed for seamless integration with any STM32 microcontroller (MCU) or microprocessor (MPU), the module supports the Matter protocol over Wi-Fi, ensuring future-proof connectivity and expanding the STM32 portfolio’s compatibility with the Matter ecosystem. It also includes 4MB Flash for code and data storage, a 40MHz crystal, and offers an integrated PCB antenna or micro RF (uFL) connector for external antenna options.
“Our collaboration delivers multiple advantages for the large community that leverages the STM32 family in embedded systems,” said Remi El-Ouazzane, President of the Microcontrollers, Digital ICs, and RF Products Group (MDRF) at STMicroelectronics. “Qualcomm’s expertise in widely used wireless connectivity technologies is now at developers’ fingertips, combined with the powerful software, tools, and features offered by the STM32 development ecosystem.”
“This is just the beginning of our mission, which we expect to deliver many further successes in enabling new and advanced edge processing applications,” said Rahul Patel, Group General Manager of the Connectivity, Broadband, and Networking Business Unit at Qualcomm Technologies, Inc. “We look forward to continuing our collaboration with STMicroelectronics to bring more unparalleled connected experiences with Wi-Fi, Bluetooth, AI, 5G, and more.”
The ST67W611M1 includes advanced hardware security, such as cryptographic accelerators and services like secure boot and secure debug, achieving PSA Certified Level 1 protection. With a 32-lead LGA package, the ST67W611M1 is highly integrated and designed for low-cost PCB designs with as few as two layers. The module is self-contained and pre-certified to meet mandatory specifications, requiring no RF design expertise from the user to create a working solution.
The module is designed for quick and seamless integration with any STM32 microcontroller or microprocessor, offering a broad range of options for performance, price, and power. These MCUs range from cost- and power-sensitive devices with the Arm® Cortex®-M0+ core to high-performance options with Cortex-M4 and Cortex-A7 cores in the STM32MP1/2 MPUs.
Samples of the ST67W611M1 are available now, with OEM availability expected in Q1 2025, and broader availability in Q2 2025. For more information, please click here.
About STMicroelectronics
STMicroelectronics is a global semiconductor manufacturer with over 50,000 employees. The company designs and builds products, solutions, and ecosystems to address the challenges and opportunities of its customers. ST’s technologies enable smarter mobility, efficient power and energy management, and large-scale deployment of autonomous connected systems. The company is committed to becoming carbon-neutral on scopes 1, 2, and partially scope 3 by 2027. For more information, visit www.st.com.
Source/Photo Credit: STMicroelectronics
(Editor’s Note: All trademarks mentioned in this article, including company names, product names, and logos, are the property of their respective owners. Use of these trademarks is for informational purposes only and does not imply any endorsement.)
